Asec Engineering Consulting GmbH

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Capacidad del proceso

Pos

Description

Unitiy

min./max.

A	Min. Track Space - Outer Layer	µm	75
B	Min. Track Width - Outer Layer	µm	75
C	Min. Track Space - Inner Layer	µm	75
D	Min. Track Width - Inner Layer	µm	75
E	Microvia diameter at capture land	µm	100
F	Microvia diameter at target land	µm	75
G	Microvia pad at capture land size	µm	250
H	Microvia pad at target land size	µm	250
I	Plated through hole min. pad	µm	500
J	Plated through hole min. diameter drilled	µm	250
K	Copper thickness base copper	µm	<=25
L	Dielectric layer thickness	µm	>40
M	Copper plating thickness in every single hole	µm	>100
N	Min. buried hole plating thickness	µm	>=20
O	Drill size buried hole	µm	250
P	Pad size buried hole, innerlayer	µm	500
Q	Thickness Dielectric layer inner layer	µm	>=50
R	Thickness copper foil	µm	<=18
S	Microvia min copper thickness	µm	>=15
T	Board thickness	mm	0.2 - 4.0
	Aspect ratio blind holes (deep/diameter)		<=1
	Plated through hole aspect ratio (PCB-Thick./Diam.)		<=8
	Aspect ratio buried holes		<=8

	Finish
1	HAL, HAL lead free
2	OSP
3	Immersion Ni/Au, Immersion tin, Immersion silver
4	Flash gold
5	Plated Ni/Au
6	Ormecon Nano Finish

	Advanced Capabilities
1	HDI Technology
2	Thick copper up to 400µm
3	Heatsink PCB
4	Impedance controlled PCB
5	Flexible and rigid-flex PCB
6	Connection Pads